JPH0727640Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0727640Y2
JPH0727640Y2 JP13813889U JP13813889U JPH0727640Y2 JP H0727640 Y2 JPH0727640 Y2 JP H0727640Y2 JP 13813889 U JP13813889 U JP 13813889U JP 13813889 U JP13813889 U JP 13813889U JP H0727640 Y2 JPH0727640 Y2 JP H0727640Y2
Authority
JP
Japan
Prior art keywords
element substrate
semiconductor element
electrode
semiconductor device
external terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP13813889U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0377454U (en]
Inventor
建志 甕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP13813889U priority Critical patent/JPH0727640Y2/ja
Publication of JPH0377454U publication Critical patent/JPH0377454U/ja
Application granted granted Critical
Publication of JPH0727640Y2 publication Critical patent/JPH0727640Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP13813889U 1989-11-29 1989-11-29 半導体装置 Expired - Fee Related JPH0727640Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13813889U JPH0727640Y2 (ja) 1989-11-29 1989-11-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13813889U JPH0727640Y2 (ja) 1989-11-29 1989-11-29 半導体装置

Publications (2)

Publication Number Publication Date
JPH0377454U JPH0377454U (en]) 1991-08-05
JPH0727640Y2 true JPH0727640Y2 (ja) 1995-06-21

Family

ID=31685260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13813889U Expired - Fee Related JPH0727640Y2 (ja) 1989-11-29 1989-11-29 半導体装置

Country Status (1)

Country Link
JP (1) JPH0727640Y2 (en])

Also Published As

Publication number Publication date
JPH0377454U (en]) 1991-08-05

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees